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SOIC - Small Outline Integrated Circuit The 'Small Outline Integrated Circuit', or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. The leads protrude from the longer edge of the package. It is one of the most commonly used surface mount packages today.What is SOIC (Small outline integrated circuit)?
A Small Outline Integrated Circuit ( SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.What is a SOIC package?
The leads protrude from the longer edge of the package. It is one of the most commonly used surface mount packages today. SOIC packages are JEDEC-compliant, and come in a variety of body widths, the most popular of which are 150 mils or 3.8 mm (narrow body) and 300 mils or 7.5 mm (wide body).What are the key features of SOIC?
It features ultra-high-density-vertical stacking for high performance, low power, and min RLC (resistance-inductance-capacitance). SoIC integrates active and passive chips into a new integrated-SoC system, which is electrically identical to native SoC, to achieve better form factor and performance. The key features of SoIC technology include: