Keyword Analysis & Research: thermal laser separation for wafer dicing

Keyword Analysis

Keyword	CPC	PCC	Volume	Score	Length of keyword
thermal laser separation for wafer dicing	1.31	0.9	2900	7	41
thermal	1.02	0.5	9823	91	7
laser	1.53	0.2	5410	3	5
separation	1.32	0.7	3321	75	10
for	0.42	0.1	9139	46	3
wafer	0.1	0.2	5537	65	5
dicing	1.15	0.2	4141	38	6

Keyword	CPC	PCC	Volume	Score
thermal laser separation for wafer dicing	1.08	0.5	5988	22